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1. (WO2018126256) CONDUCTIVE STRUCTURE

Pub. No.:    WO/2018/126256    International Application No.:    PCT/US2018/012022
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Wed Jan 03 00:59:59 CET 2018
IPC: H01L 27/11573
H01L 27/11526
H01L 27/11548
H01L 27/11575
H01L 27/11556
H01L 27/11582
Applicants: INTEL CORPORATION
Inventors: LIU, Jun
HALLER, Gordon A.
WANG, Fei
NG, Wei Yeeng
MCKINSEY, Wesley O.
XIE, Zhiqiang
ADAMS, Jeremy F.
ZHU, Hongbin
ZHAO, Jun
LEVAN, Mark A.
Title: CONDUCTIVE STRUCTURE
Abstract:
Conductive structure technology is disclosed. In one example, a conductive structure (300) includes an interconnect (320) and a plurality of conductive layers (330) overlying the interconnect. Each conductive layer is separated from an adjacent conductive layer by an insulative layer (331). In addition, the conductive structure includes a contact (340) extending through the plurality of conductive layers to the interconnect. The contact is electrically coupled to the interconnect and insulated from the plurality of conductive layers. Associated systems and methods are also disclosed.