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1. (WO2018126153) ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABRICATION METHODS

Pub. No.:    WO/2018/126153    International Application No.:    PCT/US2017/068983
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Sat Dec 30 00:59:59 CET 2017
IPC: H01L 31/16
Applicants: TEXAS INSTRUMENTS INCORPORATED
TEXAS INSTRUMENTS JAPAN LIMITED
Inventors: MALE, Barry, Jon
COOK, Benjamin
NEIDORFF, Robert, Alan
KUMMERL, Steve
Title: ISOLATOR INTEGRATED CIRCUITS WITH PACKAGE STRUCTURE CAVITY AND FABRICATION METHODS
Abstract:
Disclosed examples include integrated circuits (100) with a leadframe structure (104a, 104b), a first circuit structure (106a) including a light source (108a) configured to generate a light signal along an optical path (114), a second circuit structure (106b) including a light sensor (108b) facing the optical path (114) to receive the light signal, and a molded package structure (102) enclosing portions of the leadframe structure (104a, 104b), the molded package structure (102) having a cavity (110) defined by an interior surface of the molded package structure (102), the optical path (114) extending in the cavity (110) between the first and second circuit structures (106a, 106b).