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1. (WO2018126038) PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE
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Pub. No.: WO/2018/126038 International Application No.: PCT/US2017/068761
Publication Date: 05.07.2018 International Filing Date: 28.12.2017
IPC:
H01L 23/495 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
495
Lead-frames
Applicants:
TEXAS INSTRUMENTS INCORPORATED [US/US]; P.O. Box 655474 Mail Station 3999 Dallas, TX 75265-5474, US
TEXAS INSTRUMENTS JAPAN LIMITED [JP/JP]; 24-1, Nishi-Shinjuku 6-chome Shinjuku-ku Tokyo, 160-8366, JP (JP)
Inventors:
GUPTA, Vikas; US
LIN, Daniel, Yong; US
Agent:
DAVIS, Michael, A., Jr.; US
GARNER, Jacqueline, J.; US
Common
Representative:
TEXAS INSTRUMENTS INCORPORATED; P.O. Box 655474 Mail Station 3999 Dallas, TX 75265-5474, US
Priority Data:
15/842,60814.12.2017US
62/440,95030.12.2016US
Title (EN) PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE
(FR) DISPOSITIF À SEMI-CONDUCTEUR ENCAPSULÉ AYANT UNE SURFACE RUGUEUSE DE PARTICULES
Abstract:
(EN) A packaged semiconductor device (200) with a particle roughened surface (202) on a portion of the lead frame (203) that improves adhesion between the molding compound (112) and the lead frame (203). A packaged semiconductor device (200) with a particle roughened surface (202) on a portion of the lead frame (203) that improves adhesion between the molding compound (112) and the lead frame (203) and with a reflow wall (210) that surrounds a portion of the solder joint (208) that couples the semiconductor device (110) to the lead frame (203). A packaged semiconductor device (200) with a reflow wall (210) that surrounds a portion of a solder joint (208) that couples a semiconductor device (110) to a lead frame (203).
(FR) L'invention concerne un dispositif à semi-conducteur encapsulé (200) ayant une surface rugueuse de particules (202) sur une partie de la grille de connexion (203) à des fins d'amélioration de l'adhérence entre le composé de moulage (112) et la grille de connexion (203). Un dispositif à semi-conducteur encapsulé (200) comporte une surface rugueuse de particules (202) sur une partie de la grille de connexion (203) à des fins d'amélioration de l'adhérence entre le composé de moulage (112) et la grille de connexion (203) et une paroi de refusion (210) qui entoure une partie du joint de soudure (208) qui accouple le dispositif à semi-conducteur (110) à la grille de connexion (203). Un dispositif à semi-conducteur encapsulé (200) comporte une paroi de refusion (210) qui entoure une partie d'un joint de soudure (208) qui accouple un dispositif à semi-conducteur (110) à une grille de connexion (203).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)