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1. (WO2018125985) LED PACKAGE USING ELECTROFORM STENCIL PRINTING

Pub. No.:    WO/2018/125985    International Application No.:    PCT/US2017/068678
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Dec 29 00:59:59 CET 2017
IPC: H01L 33/48
H01L 33/60
H01L 33/62
Applicants: LUMILEDS LLC
Inventors: VAKKALANKA, Sridevi A.
PEDDADA, S. Rao
Title: LED PACKAGE USING ELECTROFORM STENCIL PRINTING
Abstract:
A method for manufacturing light emitting devices, comprising: providing a package body including: (i) a reflector cup defining a cavity and (ii) a plurality of metal pads disposed at a bottom surface of the cavity; performing reservoir stencil printing to deposit a respective solder pattern on each of the metal pads, the reservoir stencil printing being performed using a 3D electroform stencil that is placed over the reflector cup, the 3D electroform stencil including a lip configured to engage one or more sidewalls of the reflector cup, and a reservoir extending away from the lip and into the cavity; placing an LED die on the solder patterns that are formed on the metal pads and performing reflow soldering to attach the LED die to the metal pads.