Search International and National Patent Collections

1. (WO2018125905) POLISHING COMPOSITIONS

Pub. No.:    WO/2018/125905    International Application No.:    PCT/US2017/068507
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Dec 28 00:59:59 CET 2017
IPC: C09G 1/02
Applicants: FUJIFILM PLANAR SOLUTIONS, LLC
Inventors: MCDONOUGH, James
Title: POLISHING COMPOSITIONS
Abstract:
The present disclosure provides chemical mechanical polishing compositions that achieve minimal dishing at reduced dishing reducer (DR) levels when compared to known CMP compositions. The compositions of the disclosure include a dynamic surface tension reducer (DSTR) which allows for lower levels of dishing reducer in the compositions. Indeed, the compositions of the disclosure allow for lower levels of dishing reducer to achieve the same dishing as known compositions having higher levels of dishing reducer. Deleterious effects of high DR levels are thereby avoided or minimized when employing the compositions of the disclosure.