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1. (WO2018125752) APPARATUS AND METHODS FOR WAFER ROTATION TO IMPROVE SPATIAL ALD PROCESS UNIFORMITY

Pub. No.:    WO/2018/125752    International Application No.:    PCT/US2017/067923
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Dec 22 00:59:59 CET 2017
IPC: H01L 21/677
H01L 21/67
Applicants: APPLIED MATERIALS, INC.
Inventors: WEAVER, William T.
YUDOVSKY, Joseph
BLAHNIK, Jeffrey
Title: APPARATUS AND METHODS FOR WAFER ROTATION TO IMPROVE SPATIAL ALD PROCESS UNIFORMITY
Abstract:
Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer assembly with a robot blade with an opening therethrough, the opening sized to allow the support surface of the support fixture to pass through the opening. A first actuator is connected to the wafer rotation assembly to rotate the support fixture assembly about an axis of the shaft. A second actuator is connected to the wafer rotation assembly to move the support fixture assembly a stroke distance along the axis of the shaft. Process kits including the wafer rotation assemblies and robot blades with openings can used to retrofit existing mainframe processing chambers.