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1. (WO2018125505) BENT-BRIDGE SEMICONDUCTIVE APPARATUS

Pub. No.:    WO/2018/125505    International Application No.:    PCT/US2017/063978
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Dec 01 00:59:59 CET 2017
IPC: H01L 25/16
H01L 25/18
H01L 25/065
H01L 23/538
Applicants: INTEL IP CORPORATION
Inventors: WAIDHAS, Bernd
STOECKL, Stephan
WOLTER, Andreas
MAHNKOPF, Reinhard
SEIDEMANN, Georg
WAGNER, Thomas
MILLOU, Laurent
Title: BENT-BRIDGE SEMICONDUCTIVE APPARATUS
Abstract:
A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of planarity. The silicon bridge may couple two semiconductive devices, all of which are from an integral processed die.