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1. (WO2018125486) STACKED DICE SYSTEMS

Pub. No.:    WO/2018/125486    International Application No.:    PCT/US2017/063663
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Nov 30 00:59:59 CET 2017
IPC: H01L 25/065
H01L 23/12
H01L 23/00
H01L 23/48
Applicants: INTEL CORPORATION
Inventors: CHEAH, Bok Eng
KONG, Jackson Chung Peng
OOI, Kooi Chi
OOI, Ping Ping
Title: STACKED DICE SYSTEMS
Abstract:
Discussed generally herein are devices that can include multiple stacked dice electrically coupled to dice electrically coupled to a peripheral sidewall of the stacked dice and/or a dice stack electrically coupled to a passive die. In one or more embodiments a device can include a dice stack comprising at least two dice including a first die and a second die, the first die electrically connected to and on a second die, a first side pad on, or at least partially in, a first sidewall of the dice stack, a third die electrically connected to the first die at a first surface of the third die and through the first side pad, and a fourth die electrically connected to the third die at a second surface of the first die, the second side opposite the first side.