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1. (WO2018125454) INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING METAL OXIDE ADHESIVE LAYER

Pub. No.:    WO/2018/125454    International Application No.:    PCT/US2017/063365
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Wed Nov 29 00:59:59 CET 2017
IPC: H01L 21/768
Applicants: INTEL CORPORATION
Inventors: JAYWANT, Shruti Rajeev
Title: INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING METAL OXIDE ADHESIVE LAYER
Abstract:
Integrated circuit interconnect structures having a metal oxide adhesive layer between conductive interconnects and dielectric material, as well as related apparatuses and methods are disclosed herein. For example, in some embodiments, an integrated circuit interconnect structure may include a dielectric layer having 60% or more filler, a conductive layer, and a metal oxide adhesive layer between the dielectric and conductive layers. In some embodiments, the metal oxide adhesive layer may include one or more of aluminum oxide, chromium oxide, and nickel oxide.