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1. (WO2018125452) STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE

Pub. No.:    WO/2018/125452    International Application No.:    PCT/US2017/063328
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Tue Nov 28 00:59:59 CET 2017
IPC: H01L 23/482
H01L 23/498
H01L 23/485
H01L 23/13
Applicants: INTEL CORPORATION
Inventors: CHANG, Je-Young
SAHASRABUDHE, Shubhada H.
HARIRCHIAN, Tannaz
Title: STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE
Abstract:
Semiconductor packages having support members are provided. Support members can mitigate damage to a semiconductor die mounted on a semiconductor package. In some embodiments, an arrangement of support packages can be formed at respective locations of a frame layer that serves as a stiffener for the semiconductor package. Each support member in the arrangement can be formed from a same material of the frame layer or a different material. In some embodiments, a support member can be mounted or otherwise coupled to an exposed surface of the frame layer. In addition or in other embodiments, a support member can be mounted on a surface that supports the semiconductor die. The arrangement of support members can include support members comprising a first material and/or other support members formed from respective materials. A support member can be formed from a metal, a metal alloy, a semiconductor, a polymer, a composite material, or a porous material.