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1. (WO2018125451) CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

Pub. No.:    WO/2018/125451    International Application No.:    PCT/US2017/063326
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Tue Nov 28 00:59:59 CET 2017
IPC: H01L 23/552
H01L 23/60
H01L 23/36
H01L 23/28
Applicants: INTEL CORPORATION
Inventors: GAINES, Taylor
PRAKASH, Anna M.
RAMALINGAM, Suriyakala
LIU, Boxi
GUPTA, Mohit
BELMAN, Ziv
SCHIFFMANN, Baruch
HIRSHBERG, Arnon
MALAMUD, Vladimir
WITTENBERG, Ron
Title: CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
Abstract:
In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.