Search International and National Patent Collections

1. (WO2018125443) MULTI-CONDUCTOR INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

Pub. No.:    WO/2018/125443    International Application No.:    PCT/US2017/062973
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Nov 23 00:59:59 CET 2017
IPC: H01L 25/065
H01L 23/485
H01L 23/00
Applicants: INTEL CORPORATION
Inventors: OOI, Ping Ping
CHEAH, Bok Eng
KONG, Jackson Chung Peng
OOI, Kooi Chi
Title: MULTI-CONDUCTOR INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
Abstract:
A multi-conductor interconnect for a microelectronic device incorporates multiple conductors and integrated shielding for the conductors. The multi-conductor interconnect includes first and second groups of conductors interleaved with one another within a dielectric structure. One of the groups of conductors may be coupled to a reference voltage node to provide shielding for the other group of conductors. The multi-conductor interconnect may further include a shield layer extending over some portion, or all, of the conductors of the first and second groups.