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1. WO2018125440 - CONFIGURABLE SEMICONDUCTOR PACKAGE

Publication Number WO/2018/125440
Publication Date 05.07.2018
International Application No. PCT/US2017/062875
International Filing Date 21.11.2017
IPC
H01L 25/10 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10the devices having separate containers
H01L 25/18 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 23/498 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
H01L 23/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
CPC
H01L 2223/54426
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
544Marks applied to semiconductor devices or parts
54426for alignment
H01L 23/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
32Holders for supporting the complete device in operation, i.e. detachable fixtures
H01L 23/544
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
544Marks applied to semiconductor devices ; or parts; , e.g. registration marks, ; alignment structures, wafer maps
H01L 25/0655
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
065the devices being of a type provided for in group H01L27/00
0655the devices being arranged next to each other
H01L 25/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
18the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L51/00
H01L 25/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
50Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
Applicants
  • INTEL CORPORATION [US]/[US]
Inventors
  • AOKI, Russell S.
  • THIELEN, Casey G.
Agents
  • GRIFFIN III, Malvern U.
  • ZOGAIB, Nash M.
  • BRANSON, Joshua W.
  • CHAN, Christopher J.
Priority Data
15/396,43431.12.2016US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) CONFIGURABLE SEMICONDUCTOR PACKAGE
(FR) BOÎTIER DE SEMICONDUCTEUR CONFIGURABLE
Abstract
(EN)
Configurable semiconductor packages and processes to attain a defined configuration are provided. A configurable semiconductor package includes a base semiconductor package including a semiconductor die mounted on a surface of a package substrate. An expansion package can be mechanically coupled to a mounting member. The expansion package includes a second package substrate and one or more second semiconductor dies that can be surface mounted to the second package substrate. The second package substrate include an array of interconnects that permit coupling (mechanically and/or electrically) the second semiconductor die(s) to the package substrate of the base semiconductor package. The mounting member can mechanically attach to the base semiconductor package, resulting in a package assembly that has the array of interconnects adjacent to another array of interconnects in the package substrate of the base semiconductor package. The expansion package can be coupled to the base semiconductor package via the interconnects, providing expanded functionality relative to the functionality of the base semiconductor package.
(FR)
L'invention concerne des boîtiers de semiconducteurs configurables et des procédés pour atteindre une configuration définie. Un boîtier de semiconducteur configurable comprend un boîtier de semiconducteur de base comprenant une puce semiconductrice montée sur une surface d'un substrat de boîtier. Un boîtier d'expansion peut être couplé mécaniquement à un élément de montage. Le boîtier d'expansion comprend un second substrat de boîtier et une ou plusieurs secondes puces semiconductrices qui peuvent être montées en surface sur le second substrat de boîtier. Le second substrat de boîtier comprend un réseau d'interconnexions qui permettent le couplage (mécaniquement et/ou électriquement) de la seconde puce semiconductrice (s) au substrat de boîtier du boîtier de semiconducteur de base. L'élément de montage peut se fixer mécaniquement au boîtier de semiconducteur de base, ce qui permet d'obtenir un ensemble boîtier qui a le réseau d'interconnexions adjacent à un autre réseau d'interconnexions dans le substrat de boîtier du boîtier de semiconducteur de base. Le boîtier d'expansion peut être couplé au boîtier de semiconducteur de base par l'intermédiaire des interconnexions, fournissant une fonctionnalité étendue par rapport à la fonctionnalité du boîtier de semiconducteur de base.
Also published as
Latest bibliographic data on file with the International Bureau