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1. (WO2018125412) COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUCTURES

Pub. No.:    WO/2018/125412    International Application No.:    PCT/US2017/061735
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Nov 16 00:59:59 CET 2017
IPC: H01L 25/065
H01L 23/13
H01L 23/36
Applicants: INTEL CORPORATION
Inventors: KARHADE, Omkar G.
DHANE, Kedar
MIN, Yongki
LAMBERT, William J.
Title: COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUCTURES
Abstract:
Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a stiffener on a substrate, wherein a first section of the stiffener and a second section of the stiffener are on opposite sides of an opening. At least one component may be attached on the substrate within the opening, wherein the at least one component is disposed between the first section of the stiffener and the second section of the stiffener, and wherein the stiffener comprises a grounding structure disposed on the substrate.