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1. (WO2018125410) INTERNAL TO INTERNAL COAXIAL VIA TRANSITION STRUCTURES IN PACKAGE SUBSTRATES

Pub. No.:    WO/2018/125410    International Application No.:    PCT/US2017/061730
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Nov 16 00:59:59 CET 2017
IPC: H01L 25/065
H01L 25/07
H01L 23/498
H01L 23/538
Applicants: INTEL CORPORATION
Inventors: RODRIGUEZ, Adrian
PRIOLO, Matthew
Title: INTERNAL TO INTERNAL COAXIAL VIA TRANSITION STRUCTURES IN PACKAGE SUBSTRATES
Abstract:
Methods/structures of forming package structures are described. Those methods/structures may include forming a first sub-laminated board comprising a first horseshoe structure that is disposed on a top surface of a first outer ground structure, forming a second sub-laminated board comprising a second horseshoe structure disposed on a second outer ground structure, wherein the second sub-laminated board comprises a stripline trace on a top surface of the second sub-laminated board, and laminating the first sub-laminated board to the second sub-laminated board, wherein the first and second horseshoe structures are in contact with each other during the lamination process.