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1. (WO2018125240) MICROELECTRONIC DEVICES DESIGNED WITH FLEXIBLE PACKAGE SUBSTRATES WITH DISTRIBUTED STACKED ANTENNAS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/125240 International Application No.: PCT/US2016/069621
Publication Date: 05.07.2018 International Filing Date: 30.12.2016
IPC:
H01L 23/66 (2006.01) ,H01L 23/498 (2006.01) ,H01L 23/522 (2006.01) ,H01Q 1/24 (2006.01) ,H01Q 1/38 (2006.01)
Applicants: INTEL CORPORATION[US/US]; 2200 Mission College Boulevard MS: RNB-4-150 Santa Clara, California 95052, US
Inventors: KAMGAING, Telesphor; US
OSTER, Sasha N.; US
DOGIAMIS, Georgios C.; US
Agent: BRASK, Justin, K.; US
Priority Data:
Title (EN) MICROELECTRONIC DEVICES DESIGNED WITH FLEXIBLE PACKAGE SUBSTRATES WITH DISTRIBUTED STACKED ANTENNAS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS
(FR) DISPOSITIFS MICRO-ÉLECTRONIQUES CONÇUS AVEC DES SUBSTRATS DE BOÎTIER SOUPLES À ANTENNES EMPILÉES RÉPARTIES POUR SYSTÈMES DE COMMUNICATION HAUTE FRÉQUENCE
Abstract: front page image
(EN) Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
(FR) Selon certains modes de réalisation, cette invention concerne un dispositif microélectronique qui comprend un premier substrat ayant un matériau diélectrique organique, des couches conductrices, et une première partie d'une unité d'antennes réparties. Le premier substrat supporte au moins un composant radiofréquence (RF). Un second substrat est couplé au premier substrat. Le second substrat est intégré à un boîtier du dispositif microélectronique et il comprend une seconde partie de l'unité d'antennes réparties pour émettre et recevoir des communications à une fréquence d'environ 4 GHz ou plus.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)