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1. (WO2018125235) PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/125235 International Application No.: PCT/US2016/069602
Publication Date: 05.07.2018 International Filing Date: 30.12.2016
IPC:
H01L 23/00 (2006.01) ,H01L 23/544 (2006.01) ,H01L 21/768 (2006.01) ,H01L 23/525 (2006.01) ,H01L 21/56 (2006.01)
Applicants: INTEL CORPORATION[US/US]; 2200 Mission College Blvd. Santa Clara, California 95054, US
Inventors: YAZZIE, Kyle; US
MAMODIA, Mohit; US
Agent: GUGLIELMI, David L.; US
Priority Data:
Title (EN) PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION
(FR) BOÎTIER AVEC PROTECTION CATHODIQUE POUR ATTÉNUATION DE LA CORROSION
Abstract: front page image
(EN) An apparatus is provided which comprises: a substrate to couple with one or more integrated circuit die(s), an integrated circuit die coupled to the substrate, a metal component coupled to the substrate, wherein the metal component lacks a sealing coating, and a sacrificial metal conductively coupled with the metal component, wherein the sacrificial metal comprises a more anodic metal than the metal component. Other embodiments are also disclosed and claimed.
(FR) L'invention concerne un appareil qui comprend : un substrat destiné à être couplé à une ou plusieurs puces de circuit intégré , une puce de circuit intégré couplée au substrat, un composant métallique couplé au substrat, le composant métallique ne comprenant pas de revêtement d'étanchéité, et un métal sacrificiel couplé de manière conductrice au composant métallique, le métal sacrificiel comprenant un métal plus anodique que le composant métallique. L'invention se rapporte également à d'autres modes de réalisation.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)