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1. (WO2018125159) SEMICONDUCTOR PACKAGE HAVING SINGULAR WIRE BOND ON BONDING PADS

Pub. No.:    WO/2018/125159    International Application No.:    PCT/US2016/069304
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Dec 30 00:59:59 CET 2016
IPC: H01L 25/065
H01L 23/00
H01L 23/31
H01L 23/498
Applicants: INTEL CORPORATION
Inventors: XU, Yi
Title: SEMICONDUCTOR PACKAGE HAVING SINGULAR WIRE BOND ON BONDING PADS
Abstract:
Semiconductor packages including active die stacks, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package includes an active die having a top surface covered by a molding compound, and a bonding pad attached to only one interconnect wire. A method of fabricating the semiconductor package includes bridging a pair of dies stacks by the interconnect wire, and dividing the interconnect wire to form separate wire segments attached to respective die stacks.