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1. (WO2018125150) HIGH FREQUENCY WAVEGUIDE STRUCTURE
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Pub. No.: WO/2018/125150 International Application No.: PCT/US2016/069248
Publication Date: 05.07.2018 International Filing Date: 29.12.2016
IPC:
H01P 3/12 (2006.01) ,H01P 3/08 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3
Waveguides; Transmission lines of the waveguide type
12
Hollow waveguides
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3
Waveguides; Transmission lines of the waveguide type
02
with two longitudinal conductors
08
Microstrips; Strip lines
Applicants:
INTEL CORPORATION [US/US]; 2200 MIssion College Blvd. M.S RNB-4-150 Santa Clara, California 95054, US
Inventors:
NAIR, Vijay K.; US
RAORANE, Digvijay Ashokkumar; US
Agent:
BRASK, Justin, K.; US
Priority Data:
Title (EN) HIGH FREQUENCY WAVEGUIDE STRUCTURE
(FR) STRUCTURE DE GUIDE D'ONDES HAUTE FRÉQUENCE
Abstract:
(EN) An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.
(FR) L'invention concerne un circuit intégré (IC) comprenant un substrat, une première puce montée sur le substrat, une seconde puce montée sur le substrat et une structure de guide d'ondes montée sur la première puce et la seconde puce pour permettre une communication sans fil haute fréquence entre la première puce et la seconde puce.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)