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1. (WO2018125097) EMBEDDED COMPONENT AND METHODS OF MAKING THE SAME

Pub. No.:    WO/2018/125097    International Application No.:    PCT/US2016/068970
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Dec 29 00:59:59 CET 2016
IPC: H01L 23/00
H01L 23/522
Applicants: INTEL CORPORATION
Inventors: XU, Yi Elyn
KHALAF, Bilal
CARR, Dennis Sean
Title: EMBEDDED COMPONENT AND METHODS OF MAKING THE SAME
Abstract:
Various embodiments disclosed relate to a substrate for a semiconductor device. The substrate includes a first major surface and a second major surface opposite the first major surface. The substrate further includes a cavity defined by a portion of the first major surface. The cavity includes a bottom dielectric surface and a plurality of sidewalls extending from the bottom surface to the first major surface. A first portion of a first sidewall includes a conductive material.