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|1. (WO2018125026) SUPERCONDUCTING QUBIT DEVICE PACKAGES|
|Inventors:||ROBERTS, Jeanette M.
ELSHERBINI, Adel A.
SWAN, Johanna M.
YOSCOVITS, Zachary R.
THOMAS, Nicole K.
GEORGE, Hubert C.
CLARKE, James S.
|Title:||SUPERCONDUCTING QUBIT DEVICE PACKAGES|
One superconducting qubit device package disclosed herein includes a die having a first face and an opposing second face, and a package substrate having a first face and an opposing second face. The die includes a quantum device including a plurality of superconducting qubits and a plurality of resonators on the first face of the die, and a plurality of conductive pathways coupled between conductive contacts at the first face of the die and associated ones of the plurality of superconducting qubits or of the plurality of resonators. The second face of the package substrate also includes conductive contacts. The device package further includes first level interconnects disposed between the first face of the die and the second face of the package substrate, coupling the conductive contacts at the first face of the die with associated conductive contacts at the second face of the package substrate.