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1. (WO2018124597) ENCAPSULATION COMPOSITION FOR ORGANIC ELECTRONIC DEVICE, AND ENCAPSULATION FORMED USING SAME
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Pub. No.: WO/2018/124597 International Application No.: PCT/KR2017/015070
Publication Date: 05.07.2018 International Filing Date: 20.12.2017
IPC:
H01L 51/00 (2006.01) ,H01L 51/52 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52
Details of devices
Applicants:
모멘티브퍼포먼스머티리얼스코리아 주식회사 MOMENTIVE PERFORMANCE MATERIALS KOREA CO., LTD [KR/KR]; 서울시 금천구 벚꽃로 298, 803호 803, 298, Beotkkot-ro, Geumcheon-gu, Seoul 08510, KR
Inventors:
유선 YU, Sun; KR
김난수 KIM, Nan Soo; KR
정민재 JEONG, Minjae; KR
타케시수나가 TAKESHI, Sunaga; JP
Agent:
정순성 CHUNG, Soon-Sung; KR
Priority Data:
10-2016-018009527.12.2016KR
Title (EN) ENCAPSULATION COMPOSITION FOR ORGANIC ELECTRONIC DEVICE, AND ENCAPSULATION FORMED USING SAME
(FR) COMPOSITION D'ENCAPSULATION DE DISPOSITIF ÉLECTRONIQUE ORGANIQUE ET ENCAPSULATION FORMÉE À L'AIDE DE CELLE-CI
(KO) 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재
Abstract:
(EN) The present invention relates to an encapsulation composition for an organic electronic device, and an encapsulation formed using the same. The encapsulation composition according to an embodiment of the present invention comprises: 1) a first copolymer including a first unit represented by Chemical Formula 1, a second unit represented by Chemical Formula 2 and a third unit represented by Chemical Formula 3; 2) a second copolymer including the second unit represented by Chemical Formula 2 and the third unit represented by Chemical Formula 3; 3) one or more types of a photo-initiator; 4) a reactive silicon-based oligomer; and 5) a silicone acrylate-based compound.
(FR) La présente invention concerne une composition d'encapsulation d’un dispositif électronique organique et une encapsulation formée à l'aide de celle-ci. La composition d'encapsulation selon un mode de réalisation de la présente invention comprend : 1) un premier copolymère comprenant une première unité représentée par la formule chimique 1, une deuxième unité représentée par la formule chimique 2 et une troisième unité représentée par la formule chimique 3 ; 2) un second copolymère comprenant la deuxième unité représentée par la formule chimique 2 et la troisième unité représentée par la formule chimique 3 ; 3) un ou plusieurs types d'un photo-initiateur ; 4) un oligomère à base de silicium réactif ; et 5) un composé à base d'acrylate de silicone.
(KO) 본 발명은 유기 전자 소자 봉지재용 조성물 및 이를 이용하여 형성된 봉지재에 관한 것이다. 본 발명의 일 실시상태에 따른 봉지재용 조성물은, 1) 상기 화학식 1로 표시되는 제1 단위, 상기 화학식 2로 표시되는 제2 단위, 및 상기 화학식 3으로 표시되는 제3 단위를 포함하는 제1 공중합체; 2) 상기 화학식 2로 표시되는 제2 단위, 및 상기 화학식 3으로 표시되는 제3 단위를 포함하는 제2 공중합체; 3) 1종 이상의 광개시제; 4) 반응성 실리콘계 올리고머; 및 5) 실리콘 아크릴레이트계 화합물을 포함한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)