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1. (WO2018124578) METHOD FOR PREPARING HOT-MELT ADHESIVE RESIN COMPOSITION
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Pub. No.: WO/2018/124578 International Application No.: PCT/KR2017/014954
Publication Date: 05.07.2018 International Filing Date: 18.12.2017
IPC:
C09J 125/10 (2006.01) ,C09J 165/00 (2006.01) ,C09J 9/00 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
125
Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
02
Homopolymers or copolymers of hydrocarbons
04
Homopolymers or copolymers of styrene
08
Copolymers of styrene
10
with conjugated dienes
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
165
Adhesives based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Adhesives based on derivatives of such polymers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
Applicants:
한화케미칼 주식회사 HANWHA CHEMICAL CORPORATION [KR/KR]; 서울시 중구 청계천로 86 86, Cheonggyecheon-ro, Jung-gu, Seoul 04541, KR
Inventors:
변도현 BYUN, Do Hyun; KR
성필제 SEONG, Pil Je; KR
윤경준 YOON, Kyong Jun; KR
장영 ZHANG, Ying; KR
Agent:
유미 특허법인 YOU ME PATENT AND LAW FIRM; 서울시 강남구 테헤란로 115 115 Teheran-ro Gangnam-gu Seoul 06134, KR
Priority Data:
10-2016-017950126.12.2016KR
Title (EN) METHOD FOR PREPARING HOT-MELT ADHESIVE RESIN COMPOSITION
(FR) PROCÉDÉ DE PRÉPARATION D'UNE COMPOSITION DE RÉSINE ADHÉSIVE THERMOFUSIBLE
(KO) 핫멜트 접착 수지 조성물의 제조방법
Abstract:
(EN) The present invention relates to a method for preparing a hot-melt adhesive resin composition having improved thermal stability. According to the preparation method, an SBS resin and an aromatic component-added dicyclopentadiene resin are mixed in a predetermined ratio, and then a hydrogenation reaction is carried out in a heterogeneous catalyst, thereby enabling the thermal stability of a hot melt to be improved through removal of the double bond of a polybutadiene block within the SBS resin.
(FR) La présente invention concerne un procédé de préparation d'une composition de résine adhésive thermofusible présentant une stabilité thermique améliorée. Selon le procédé de préparation, une résine SBS et une résine de dicyclopentadiène additionnée d'un composant aromatique sont mélangées selon un rapport prédéterminé, puis une réaction d'hydrogénation est mise en œuvre avec un catalyseur hétérogène, ce qui permet d'améliorer la stabilité thermique d'une résine thermofusible grâce à l'élimination de la double liaison d'un motif polybutadiène à l'intérieur de la résine SBS.
(KO) 본 발명은 열안정성이 향상된 핫멜트 접착 수지 조성물의 제조방법에 관한 것이다. 상기 제조방법에 따르면, SBS 수지와 방향족 성분이 첨가된 디사이클로펜타디엔 수지를 일정 비율로 혼합 후, 비균질계 촉매에서 수소 첨가 반응을 진행함으로써, SBS 수지내의 폴리부타디엔 블록 (polybutadiene block)의 이중결합 제거를 통해 핫멜트의 열안정성 향상시킬 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)