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|1. (WO2018124263) BONDING MATERIAL, AND BONDING METHOD USING SAME|
|Applicants:||DOWA ELECTRONICS MATERIALS CO., LTD.
|Title:||BONDING MATERIAL, AND BONDING METHOD USING SAME|
The purpose of the present invention is to provide a bonding material having both good dispensing properties and bondability, and a bonding method using the bonding material. Provided are: a bonding material that contains silver fine particles for which the average primary particle diameter is 130 nm or less, and a crosslinked-type interparticle-distance-maintaining agent that crosslinks between the silver fine particles and maintains a gap between the silver fine particles; and a bonding method using the bonding material.