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1. (WO2018124263) BONDING MATERIAL, AND BONDING METHOD USING SAME

Pub. No.:    WO/2018/124263    International Application No.:    PCT/JP2017/047171
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Dec 29 00:59:59 CET 2017
IPC: H01B 1/22
B22F 1/00
B22F 1/02
H01B 1/00
Applicants: DOWA ELECTRONICS MATERIALS CO., LTD.
DOWAエレクトロニクス株式会社
Inventors: FUJIMOTO Hideyuki
藤本 英幸
ENDOH Keiichi
遠藤 圭一
HORI Tatsuro
堀 達朗
KURITA Satoru
栗田 哲
Title: BONDING MATERIAL, AND BONDING METHOD USING SAME
Abstract:
The purpose of the present invention is to provide a bonding material having both good dispensing properties and bondability, and a bonding method using the bonding material. Provided are: a bonding material that contains silver fine particles for which the average primary particle diameter is 130 nm or less, and a crosslinked-type interparticle-distance-maintaining agent that crosslinks between the silver fine particles and maintains a gap between the silver fine particles; and a bonding method using the bonding material.