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1. (WO2018124164) RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD

Pub. No.:    WO/2018/124164    International Application No.:    PCT/JP2017/046851
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Dec 28 00:59:59 CET 2017
IPC: C08L 63/00
B32B 5/28
B32B 15/08
B32B 17/04
C08F 222/40
C08K 5/315
C08K 5/3417
C08K 7/14
C08L 83/06
H05K 1/03
H05K 3/46
Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC.
三菱瓦斯化学株式会社
Inventors: YAMAGUCHI, Shohei
山口 翔平
HAMAJIMA, Tomoki
濱嶌 知樹
KUBO, Takashi
久保 孝史
ITO, Meguru
伊藤 環
SHIGA, Eisuke
志賀 英祐
Title: RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD
Abstract:
In order to provide a resin composition having a high glass transition temperature (high Tg) or not having a definite glass transition temperature (Tg-less), whereby warping can be adequately reduced (low warping can be achieved) in a printed wiring board, particularly a multilayer coreless substrate, and to provide a prepreg, a laminate, a metal foil clad laminate, a printed wiring board, and a multilayer printed wiring board, this resin composition contains a maleimide compound (A), an allylphenol derivative (B), an epoxy-modified cyclic silicone compound (C), and an alkenyl-substituted nadiimide compound (D). The content of the epoxy-modified cyclic silicone compound (C) in the resin composition is 10-25 parts by mass with respect to 100 parts by mass of the resin solid content.