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1. WO2018124116 - SURFACE TREATMENT MATERIAL AND METHOD FOR MANUFACTURING SAME, AND ARTICLE FABRICATED USING SURFACE TREATMENT MATERIAL

Publication Number WO/2018/124116
Publication Date 05.07.2018
International Application No. PCT/JP2017/046750
International Filing Date 26.12.2017
IPC
C25D 5/44 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34Pretreatment of metallic surfaces to be electroplated
42of light metals
44Aluminium
B32B 15/01 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
01all layers being exclusively metallic
C25D 5/10 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10Electroplating with more than one layer of the same or of different metals
C25D 5/12 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10Electroplating with more than one layer of the same or of different metals
12at least one layer being of nickel or chromium
C25D 5/30 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
24Electroplating of metal surfaces to which a coating cannot readily be applied
30of surfaces of light metals
C25D 5/42 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34Pretreatment of metallic surfaces to be electroplated
42of light metals
CPC
B32B 15/01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
01all layers being exclusively metallic
C23C 18/1651
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1646Characteristics of the product obtained
165Multilayered product
1651Two or more layers only obtained by electroless plating
C23C 18/1653
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1646Characteristics of the product obtained
165Multilayered product
1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
C23C 18/1831
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1803of metallic material surfaces or of a non-specific material surfaces
1824by chemical pretreatment
1827only one step pretreatment
1831Use of metal, e.g. activation, sensitisation with noble metals
C25D 3/12
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
3Electroplating: Baths therefor
02from solutions
12of nickel or cobalt
C25D 3/30
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
3Electroplating: Baths therefor
02from solutions
30of tin
Applicants
  • 古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP]/[JP]
Inventors
  • 山内 美保 YAMAUCHI Miho
  • 小林 良聡 KOBAYASHI Yoshiaki
Agents
  • アインゼル・フェリックス=ラインハルト EINSEL Felix-Reinhard
  • 前川 純一 MAEKAWA Junichi
  • 二宮 浩康 NINOMIYA Hiroyasu
  • 上島 類 UESHIMA Rui
  • 住吉 秀一 SUMIYOSHI Shuichi
Priority Data
2016-25392027.12.2016JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SURFACE TREATMENT MATERIAL AND METHOD FOR MANUFACTURING SAME, AND ARTICLE FABRICATED USING SURFACE TREATMENT MATERIAL
(FR) MATÉRIAU DE TRAITEMENT DE SURFACE ET SON PROCÉDÉ DE FABRICATION, ARTICLE FABRIQUÉ À L'AIDE DU MATÉRIAU DE TRAITEMENT DE SURFACE
(JA) 表面処理材及びその製造方法、並びにこの表面処理材を用いて作製した部品
Abstract
(EN)
This surface treatment material (10) has an electroconductive substrate (1) and a surface treatment coating (2) comprising at least one metal layer formed on the electroconductive substrate (1), a lowermost metal layer (21) that is the metal layer formed on the electroconductive substrate (1) among the at least one metal layer being nickel, a nickel alloy, cobalt, a cobalt alloy, copper, or a copper alloy, an interposed layer (3) containing a metal component in the electroconductive substrate (1), a metal component in the surface treatment coating (2), and an oxygen component being present between the electroconductive substrate (1) and the surface treatment coating (2), and the average thickness of the interposed layer (3) being in the range of 1.00 nm to 40 nm as measured in a vertical cross-section of the surface treatment material.
(FR)
L'invention concerne un matériau de traitement de surface (10) qui possède un substrat conducteur de l'électricité (1) et un revêtement de traitement de surface (2) comprenant au moins une couche métallique formée sur le substrat conducteur de l'électricité (1), une couche métallique inférieure (21), qui est la couche métallique formée sur le substrat conducteur de l'électricité (1) parmi lesdites couches métalliques, étant du nickel, un alliage de nickel, du cobalt, un alliage de cobalt, du cuivre ou un alliage de cuivre, une couche intercalée (3) contenant un élément métallique dans le substrat conducteur de l'électricité (1), un élément métallique dans le revêtement de traitement de surface (2), et un élément oxygène étant présent entre le substrat conducteur de l'électricité (1) et le revêtement de traitement de surface (2), et l'épaisseur moyenne de la couche intercalée (3) s'inscrivant dans la plage allant de 1,00 nm à 40 nm telle que mesurée dans une section transversale verticale du matériau de traitement de surface.
(JA)
本発明の表面処理材(10)は、導電性基体(1)と、導電性基体(1)上に形成された少なくとも1層の金属層からなる表面処理被膜(2)とを有する表面処理材であって、少なくとも1層の金属層のうち、導電性基体(1)上に形成されている金属層である最下金属層(21)が、ニッケル、ニッケル合金、コバルト、コバルト合金、銅又は銅合金であり、導電性基体(1)と表面処理被膜(2)の間に、導電性基体(1)中の金属成分と、表面処理被膜(2)中の金属成分と、酸素成分とを含有する介在層(3)を有し、介在層(3)の平均厚さが、表面処理材の垂直断面で測定して、1.00nm以上40nm以下の範囲である。
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