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1. (WO2018124114) SURFACE TREATMENT MATERIAL AND ARTICLE FABRICATED USING SAME
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Pub. No.: WO/2018/124114 International Application No.: PCT/JP2017/046748
Publication Date: 05.07.2018 International Filing Date: 26.12.2017
IPC:
C25D 5/42 (2006.01) ,C25D 5/12 (2006.01) ,C25D 5/44 (2006.01) ,C25D 7/00 (2006.01) ,H01R 13/03 (2006.01) ,H01R 43/16 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34
Pretreatment of metallic surfaces to be electroplated
42
of light metals
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10
Electroplating with more than one layer of the same or of different metals
12
at least one layer being of nickel or chromium
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
34
Pretreatment of metallic surfaces to be electroplated
42
of light metals
44
Aluminium
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
02
Contact members
03
characterised by the material, e.g. plating or coating materials
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43
Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
16
for manufacturing contact members, e.g. by punching and by bending
Applicants:
古河電気工業株式会社 FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 東京都千代田区丸の内二丁目2番3号 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
小林 良聡 KOBAYASHI Yoshiaki; JP
山内 美保 YAMAUCHI Miho; JP
Agent:
アインゼル・フェリックス=ラインハルト EINSEL Felix-Reinhard; JP
前川 純一 MAEKAWA Junichi; JP
二宮 浩康 NINOMIYA Hiroyasu; JP
上島 類 UESHIMA Rui; JP
住吉 秀一 SUMIYOSHI Shuichi; JP
Priority Data:
2016-25391727.12.2016JP
Title (EN) SURFACE TREATMENT MATERIAL AND ARTICLE FABRICATED USING SAME
(FR) MATÉRIAU DE TRAITEMENT DE SURFACE ET ARTICLE FABRIQUÉ À L'AIDE DUDIT MATÉRIAU
(JA) 表面処理材およびこれを用いて作製した部品
Abstract:
(EN) The present invention provides a surface treatment material and an article fabricated using the same, whereby a surface treatment coating can be formed easily, with good adhesion, and in a short time on an electroconductive substrate that mainly comprises a base metal having particularly high ionization tendency and on which a sound plating coating is considered difficult to form. This surface treatment material (10) has an electroconductive substrate (1) and a surface treatment coating (2) comprising at least one metal layer (3, 4) formed on the electroconductive substrate (1), and among the at least one metal layer (3, 4), the lowermost metal layer (3) formed directly on the electroconductive substrate (1) has a plurality of metal embedded parts (3a) interspersed on the electroconductive substrate (1) and extending continuously from the surface of the electroconductive substrate (1) toward the inside thereof.
(FR) La présente invention concerne un matériau de traitement de surface, et un article fabriqué à l'aide dudit matériau et avec lequel un revêtement de traitement de surface peut être formé facilement, ayant une bonne adhérence en un court laps de temps sur un substrat conducteur de l'électricité, qui comprend principalement un métal de base ayant une tendance à l'ionisation particulièrement élevée et sur lequel un revêtement de placage sonore est considéré comme difficile à former. Ledit matériau de traitement de surface (10) comprend un substrat conducteur de l'électricité (1) et un revêtement de traitement de surface (2) comprenant au moins une couche métallique (3, 4) formée sur le substrat conducteur de l'électricité (1), et, parmi la ou les couches métalliques (3, 4), la couche métallique la plus basse (3), formée directement sur le substrat conducteur de l'électricité (1), possède une pluralité de parties intégrées métalliques (3a) intercalées sur le substrat conducteur de l'électricité (1) et s'étendant sans interruption de la surface du substrat conducteur de l'électricité (1) vers l'intérieur de ce dernier.
(JA) 本発明は、特にイオン化傾向が大きい卑な金属で主として構成され、健全なめっき被膜の形成が難しいとされる導電性基体上に、表面処理被膜を密着性よくかつ簡便に短時間で形成できる表面処理材及びこれを用いて作製した部品を提供する。 本発明の表面処理材(10)は、導電性基体(1)と、この導電性基体(1)上に形成された少なくとも1層以上の金属層(3、4)からなる表面処理被膜(2)とを有し、少なくとも1層以上の金属層(3、4)のうち、導電性基体(1)上に直接形成されている最下金属層(3)が、導電性基体(1)に点在しかつ導電性基体(1)の表面から内部に向かって連続して延在する複数の金属埋設部(3a)を有している。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)