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1. WO2018124109 - CLEANING LIQUID COMPOSITION

Publication Number WO/2018/124109
Publication Date 05.07.2018
International Application No. PCT/JP2017/046737
International Filing Date 26.12.2017
IPC
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
C11D 7/32 2006.01
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7Compositions of detergents based essentially on non-surface-active compounds
22Organic compounds
32containing nitrogen
C11D 7/36 2006.01
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7Compositions of detergents based essentially on non-surface-active compounds
22Organic compounds
36containing phosphorus
C11D 17/08 2006.01
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
17Detergent materials or soaps characterised by their shape or physical properties
08Liquid soap; capsuled
C23G 1/20 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
1Cleaning or pickling metallic material with solutions or molten salts
14with alkaline solutions
20Other heavy metals
CPC
C11D 11/0047
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
11Special methods for preparing compositions containing mixtures of detergents
0005Special cleaning and washing methods
0011characterised by the objects to be cleaned
0023"Hard" surfaces
0047Electronic devices, e.g. PCBs, semiconductors
C11D 17/0008
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
17Detergent materials characterised by their shape or physical properties
0008aqueous liquid non soap compositions
C11D 17/08
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
17Detergent materials characterised by their shape or physical properties
08Liquid soap, ; e.g. for dispensers; capsuled
C11D 3/28
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
3Other compounding ingredients of detergent compositions covered in group C11D1/00
16Organic compounds
26containing nitrogen
28Heterocyclic compounds containing nitrogen in the ring
C11D 3/30
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
3Other compounding ingredients of detergent compositions covered in group C11D1/00
16Organic compounds
26containing nitrogen
30Amines; Substituted amines ; ; Quaternized amines
C11D 3/33
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
3Other compounding ingredients of detergent compositions covered in group C11D1/00
16Organic compounds
26containing nitrogen
33Amino carboxylic acids
Applicants
  • 関東化學株式会社 KANTO KAGAKU KABUSHIKI KAISHA [JP]/[JP]
Inventors
  • 守田 菊恵 MORITA, Kikue
  • 高中 亞鈴治 TAKANAKA, Areji
  • 大和田 拓央 OHWADA, Takuo
Agents
  • 葛和 清司 KUZUWA, Kiyoshi
Priority Data
2016-25431227.12.2016JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CLEANING LIQUID COMPOSITION
(FR) COMPOSITION LIQUIDE DE NETTOYAGE
(JA) 洗浄液組成物
Abstract
(EN)
Provided is a cleaning liquid composition which is useful for cleaning of a substrate or the like that has been subjected to a chemical mechanical polishing (CMP) process in the production steps of an electronic device such as a semiconductor element. A cleaning liquid composition according to the present invention is used for the purpose of cleaning a substrate that has a Cu wiring line, and comprises one or more basic compounds and one or more nitrogen-containing monocyclic heterocyclic aromatic compounds that contain one or more carboxyl groups or ester groups, provided that in cases where one or more amino groups are contained therein, only amino groups directly bonded to a nitrogen-containing heterocyclic ring are contained. This cleaning liquid composition has a hydrogen ion concentration (pH) of 8-12.
(FR)
La présente invention concerne une composition liquide de nettoyage qui sert au nettoyage d'un substrat ou similaire qui a été soumis à un procédé de polissage chimico-mécanique (CMP) lors des étapes de production d'un dispositif électronique tel qu'un élément semi-conducteur. Une composition liquide de nettoyage selon la présente invention est utilisée dans le but de nettoyer un substrat qui présente une ligne de câblage en Cu, et comprend un ou plusieurs composés basiques et un ou plusieurs composés aromatiques hétérocycliques monocycliques contenant de l'azote qui contiennent un ou plusieurs groupes carboxyle ou groupes ester, à condition que, dans les cas où un ou plusieurs groupes amino y sont contenus, seuls des groupes amino directement liés à un noyau hétérocyclique contenant de l'azote soient contenus. Cette composition liquide de nettoyage présente une concentration en ions hydrogène (pH) comprise entre 8 et 12.
(JA)
半導体素子などの電子デバイスの製造工程における、化学的機械研磨(CMP)処理などを施された基板などの洗浄において、有用な洗浄液組成物を提供する。 本発明の洗浄液組成物は、Cu配線を有する基板を洗浄するための洗浄液組成物であって、塩基性化合物を1種または2種以上と、カルボキシル基またはエステル基を1つ以上有する、ただしアミノ基を1つ以上有する場合は含窒素複素環に直接結合するアミノ基のみを有する、含窒素複素環式単環芳香族化合物を1種または2種以上とを含み、水素イオン濃度(pH)が8~12である、前記洗浄液組成物である。
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