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1. (WO2018123977) WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD

Pub. No.:    WO/2018/123977    International Application No.:    PCT/JP2017/046441
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Tue Dec 26 00:59:59 CET 2017
IPC: H05K 3/10
H05K 1/02
Applicants: FUJIKURA LTD.
株式会社フジクラ
Inventors: KAIZU, Masahiro
海津 雅洋
Title: WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD
Abstract:
A wiring substrate 1 comprises: a support 10 including at least one woven fabric 11 that is woven using weaving yarns 12, 13, which are respectively constituted by bundling insulating fibers 121, 131; and a conductor 20 supported by the support 10. The conductor 20 includes a first conduction path 21 that is provided to a first main surface 101 of the support 10 and that extends in the plane direction of the first main surface 101. The first conduction path 21 includes at least one of a first conductor section 211 that exists in a basket hole 14 of the woven fabric 11, and a first intermediate section 212 that exists in a gap between the insulating fibers 121, 131.