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1. (WO2018123884) SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/123884    International Application No.:    PCT/JP2017/046173
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Sat Dec 23 00:59:59 CET 2017
IPC: H01L 27/146
G02B 5/20
H04N 9/07
Applicants: TOPPAN PRINTING CO.,LTD.
凸版印刷株式会社
Inventors: IMOTO Tomohiro
井本 知宏
TAKAHASHI Satoshi
高橋 聡
Title: SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SAME
Abstract:
Provided is a highly-precise and highly-sensitive solid-state imaging element that causes a reduction in color mixing. This solid-state imaging element is provided with: a semiconductor substrate (10) on which a plurality of photoelectric conversion elements (11) are two-dimensionally arranged; a color filer layer (30) on which color filters of a plurality of colors are two-dimensionally arranged in a preset regular pattern; and a lower layer planarizing layer (12) that is arranged only between a color filter (14) of a first color and the semiconductor substrate (10). The following expressions are satisfied: 200 [nm]≤A≤ 700 [nm]; 0 [nm]≤B≤ 200 [nm]; and C≤A+B+200 [nm], where A [nm] represents the film thickness of the color filter (14) of the first color, B [nm] represents the film thickness of the lower layer planarizing layer (12), and C [nm] represents the film thicknesses of color films (15, 16) of colors other than the first color.