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1. (WO2018123836) PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE
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Pub. No.: WO/2018/123836 International Application No.: PCT/JP2017/046051
Publication Date: 05.07.2018 International Filing Date: 22.12.2017
IPC:
G03F 7/027 (2006.01) ,B32B 15/088 (2006.01) ,B32B 27/34 (2006.01) ,C08J 7/00 (2006.01) ,G03F 7/20 (2006.01) ,G03F 7/40 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27
Layered products essentially comprising synthetic resin
34
comprising polyamides
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
7
Chemical treatment or coating of shaped articles made of macromolecular substances
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26
Processing photosensitive materials; Apparatus therefor
40
Treatment after imagewise removal, e.g. baking
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
岩井 悠 IWAI Yu; JP
渋谷 明規 SHIBUYA Akinori; JP
Agent:
特許業務法人特許事務所サイクス SIKS & CO.; 東京都中央区京橋一丁目8番7号 京橋日殖ビル8階 8th Floor, Kyobashi-Nisshoku Bldg., 8-7, Kyobashi 1-chome, Chuo-ku, Tokyo 1040031, JP
Priority Data:
2016-25616728.12.2016JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM DURCI, STRATIFIÉ, PROCÉDÉ DE FABRICATION DE FILM DURCI, PROCÉDÉ DE FABRICATION DE STRATIFIÉ ET DISPOSITIF À SEMI-CONDUCTEURS
(JA) 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイス
Abstract:
(EN) Provided are the following: a photosensitive resin composition with which a pattern can be formed by means of photo-radical polymerization, and with which a cured film exhibiting high breaking elongation cane be obtained; a cured film; a laminate; a method for producing a cured film; a method for producing a laminate; and a semiconductor device. The photosensitive resin composition contains: a polyimide precursor containing a repeating unit represented by formula (1); and a photo-radical polymerization initiator. In formula (1), A1 and A2 each denote an oxygen atom or NH, R111 denotes a divalent organic group, R115 denotes a tetravalent organic group, and R113 and R114 each denote a hydrogen atom or a monovalent organic group. A group represented by formula (2) is bonded to a terminal of at least one of R111, R113, R114 and R115. In formula (2), R1 denotes a hydrogen atom or a substituent group, and * denotes the bonding position to R111, R113, R114 or R115.
(FR) L'invention concerne les éléments suivants : une composition de résine photosensible qui permet de former un motif au moyen d'une polymérisation photo-radicalaire et d’obtenir un film durci présentant un taux élevé d’allongement à la rupture ; un film durci ; un stratifié ; un procédé de fabrication d'un film durci ; un procédé de fabrication d'un stratifié ; un dispositif à semi-conducteurs. La composition de résine photosensible contient : un précurseur de polyimide contenant des motifs répétés représentés par la formule (1) ; un initiateur de polymérisation photo-radicalaire. Dans la formule (1), A1 et A2 représentent chacun un atome d'oxygène ou NH, R111 représente un groupe organique divalent, R115 représente un groupe organique tétravalent, et R113 et R114 représentent chacun un atome d'hydrogène ou un groupe organique monovalent. Un groupe représenté par la formule (2) est lié à une borne d'au moins un élément parmi R111, R113, R114 et R115. Dans la formule (2), R1représente un atome d'hydrogène ou un groupe substituant, et * représente la position de liaison à R111, R113, R114 ou R115.
(JA) 光ラジカル重合によりパターンを形成できる感光性樹脂組成物であって、得られる硬化膜の破断伸び率が高い感光性樹脂組成物、ならびに、硬化膜、積層体、硬化膜の製造方法、積層体の製造方法および半導体デバイスの提供。 式(1)で表される繰り返し単位を含むポリイミド前駆体、および、光ラジカル重合開始剤を含む感光性樹脂組成物;式(1)中、AおよびAは酸素原子またはNHを表し、R111は2価の有機基を表し、R115は4価の有機基を表し、R113およびR114は水素原子または1価の有機基を表す;R111、R113、R114およびR115の少なくとも1つの末端には式(2)で表される基が結合している;式(2)において、Rは、水素原子または置換基を表し、*はR111、R113、R114またはR115との結合部位である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)