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1. (WO2018123826) NEGATIVE PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD
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Pub. No.: WO/2018/123826 International Application No.: PCT/JP2017/046022
Publication Date: 05.07.2018 International Filing Date: 21.12.2017
IPC:
G03F 7/075 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01) ,H05K 3/28 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
075
Silicon-containing compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
太陽インキ製造株式会社 TAIYO INK MFG. CO., LTD. [JP/JP]; 埼玉県比企郡嵐山町大字平澤900番地 900, Oaza Hirasawa, Ranzan-machi, Hiki-gun, Saitama 3550215, JP
Inventors:
嶋宮 歩 SHIMAMIYA Ayumu; JP
Agent:
本多 一郎 HONDA Ichiro; JP
Priority Data:
2016-25691928.12.2016JP
2017-05896124.03.2017JP
Title (EN) NEGATIVE PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD
(FR) COMPOSITION DE RÉSINE PHOTODURCISSABLE NÉGATIVE, FILM SEC, PRODUIT DURCI ET CARTE DE CÂBLAGE IMPRIMÉE
(JA) ネガ型光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
Abstract:
(EN) The present invention is able to provide: a negative photocurable resin composition which is capable of forming a cured product that has excellent resolution, high heat resistance and high elongation; a dry film which has a resin layer that is obtained from this composition; a cured product of this dry film; and a printed wiring board which comprises this cured product. A negative photocurable resin composition which is characterized by containing (A) an alkali-soluble resin, (B) an organosiloxane compound having a cyclic siloxane skeleton with 6 or more ring members and (C) a photopolymerization initiator, and which is also characterized in that the organosiloxane compound (B) having a cyclic siloxane skeleton with 6 or more ring members has a skeleton represented by general formula (1). (In the formula, n represents an integer of 1 or more.)
(FR) La présente invention porte sur : une composition de résine photodurcissable négative qui est apte à former un produit durci présentant une excellente résolution, une résistance à la chaleur élevée et un allongement élevé ; un film sec qui a une couche de résine qui est obtenue à partir de ladite composition ; un produit durci de ce film sec ; et une carte de câblage imprimé qui comprend ce produit durci. L'invention concerne une composition de résine photodurcissable négative qui est caractérisée en ce qu'elle comprend (A) une résine soluble en milieu alcalin, (B) un composé organosiloxane présentant un squelette siloxane cyclique ayant au moins 6 chaînons de cycle et (C) un initiateur de photopolymérisation, et qui est également caractérisé en ce que le composé organosiloxane (B) présentant un squelette siloxane cyclique ayant au moins 6 chaînons de cycle présente un squelette représenté par la formule générale (1). (Dans la formule, n représente un nombre entier supérieure ou égal à 1.)
(JA) 解像性に優れ、高耐熱性および高伸び率の硬化物を形成可能なネガ型光硬化性樹脂組成物、該組成物から得られる樹脂層を有するドライフィルム、その硬化物および該硬化物を有するプリント配線板を提供することができる。(A)アルカリ可溶性樹脂、(B)6員環以上の環状シロキサン骨格を有するオルガノシロキサン化合物、および、(C)光重合開始剤を含み、前記(B)6員環以上の環状シロキサン骨格を有するオルガノシロキサン化合物が、下記一般式(1)で表される骨格を有することを特徴とするネガ型光硬化性樹脂組成物等である。 (式中、nは1以上の整数を示す)
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)