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1. (WO2018123804) DICING FILM BASE AND DICING FILM

Pub. No.:    WO/2018/123804    International Application No.:    PCT/JP2017/045918
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Dec 22 00:59:59 CET 2017
IPC: H01L 21/301
B32B 27/32
C09J 7/20
Applicants: DUPONT-MITSUI POLYCHEMICALS CO., LTD.
三井・デュポンポリケミカル株式会社
Inventors: NAKANO, Shigenori
中野 重則
SAKUMA, Masami
佐久間 雅巳
FUKUYAMA, Kana
福山 佳那
Title: DICING FILM BASE AND DICING FILM
Abstract:
Provided is a dicing film base having excellent heat resistance and an excellent balance between chip cutting properties and extendibility. A dicing film base comprising: a first resin layer which is made from a resin composition containing 30 to 95 parts by mass inclusive of at least one resin (A) selected from the group consisting of an ethylene-unsaturated carboxylic acid copolymer and an ionomer of the ethylene-unsaturated carboxylic acid copolymer, 5 parts by mass or more and less than 40 parts by mass of at least one resin (B) selected from the group consisting of a polyamide and a polyurethane, and 0 to 30 parts by mass inclusive of an antistatic agent (C) other than the polyamide (wherein the total amount of the resin (A), the resin (B) and the antistatic agent (C) is 100 parts by mass); and a second resin layer which contains at least one resin (D) selected from the group consisting of an ethylene-unsaturated carboxylic acid copolymer and an ionomer of the ethylene-unsaturated carboxylic acid copolymer.