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1. (WO2018123699) HIGH-FREQUENCY MODULE
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Pub. No.: WO/2018/123699 International Application No.: PCT/JP2017/045404
Publication Date: 05.07.2018 International Filing Date: 18.12.2017
IPC:
H01L 23/12 (2006.01) ,H01L 25/04 (2014.01) ,H01L 25/18 (2006.01) ,H05K 1/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
Applicants:
株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP/JP]; 京都府長岡京市東神足1丁目10番1号 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555, JP
Inventors:
安田 智美 YASUDA, Tomomi; JP
Agent:
吉川 修一 YOSHIKAWA, Shuichi; JP
傍島 正朗 SOBAJIMA, Masaaki; JP
Priority Data:
2016-25450727.12.2016JP
Title (EN) HIGH-FREQUENCY MODULE
(FR) MODULE HAUTE FRÉQUENCE
(JA) 高周波モジュール
Abstract:
(EN) A high-frequency module (1), provided with a substrate (10), and a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has protrusions (20) projecting from the main surface (10a). The first electronic component (30) is mounted on a region of the main surface (10a) different from the regions to which the protrusions (20) are provided. The second electronic component (40) is mounted on the protrusions (20).
(FR) L'invention concerne un module haute fréquence (1) comprenant un substrat (10), ainsi qu'un premier composant électronique (30) et un second composant électronique (40) montés sur une surface principale (10a) du substrat (10). Le substrat (10) comporte des saillies (20) s'étendant à partir de la surface principale (10a). Le premier composant électronique (30) est monté sur une région de la surface principale (10a) différente des régions qui présentent des saillies (20). Le second composant électronique (40) est monté sur les saillies (20).
(JA) 高周波モジュール(1)は、基板(10)と、基板(10)の主面(10a)に実装される第1電子部品(30)および第2電子部品(40)とを備えている。基板(10)は、主面(10a)から突出する突起部(20)を有し、第1電子部品(30)は、主面(10a)のうち突起部(20)が設けられた領域と異なる領域に実装され、第2電子部品(40)は、突起部(20)上に実装されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)