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1. (WO2018123695) CURABLE COMPOSITION, BASE RESIN, CURING AGENT, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
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Pub. No.: WO/2018/123695 International Application No.: PCT/JP2017/045382
Publication Date: 05.07.2018 International Filing Date: 18.12.2017
IPC:
C08L 101/00 (2006.01) ,C08G 59/17 (2006.01) ,C08K 3/36 (2006.01) ,C08L 63/00 (2006.01) ,H05K 3/28 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101
Compositions of unspecified macromolecular compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
14
Polycondensates modified by chemical after-treatment
16
by monocarboxylic acids or by anhydrides, halides or low-molecular-weight esters thereof
17
by acrylic or methacrylic acid
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
34
Silicon-containing compounds
36
Silica
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
Applicants:
太陽インキ製造株式会社 TAIYO INK MFG. CO., LTD. [JP/JP]; 埼玉県比企郡嵐山町大字平澤900番地 900, Oaza Hirasawa, Ranzan-machi, Hiki-gun, Saitama 3550215, JP
Inventors:
加藤 文崇 KATO Fumitaka; JP
依田 健志 YODA Takeshi; JP
高橋 元範 TAKAHASHI Motonori; JP
伊藤 信人 ITO Nobuhito; JP
Agent:
本多 一郎 HONDA Ichiro; JP
Priority Data:
2016-25691828.12.2016JP
Title (EN) CURABLE COMPOSITION, BASE RESIN, CURING AGENT, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD
(FR) COMPOSITION DURCISSABLE, RÉSINE DE BASE, AGENT DE DURCISSEMENT, FILM SEC, PRODUIT DURCI, ET CARTE À CIRCUIT IMPRIMÉ
(JA) 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板
Abstract:
(EN) Provided are a curable composition with which it is possible to obtain a cured product having exceptional strength, a base resin, a curing agent, a dry film, a cured product, and a printed wiring board. A curable composition containing (A) a curable component and (B) a surface-treated filler, wherein the curable composition, etc., is characterized by containing (B-1) a surface-treated filler having photocurable reactive groups and thermosetting reactive groups as the (B) surface-treated filler.
(FR) L'invention concerne une composition durcissable avec laquelle il est possible d'obtenir un produit durci possédant une résistance exceptionnelle, une résine de base, un agent de durcissement, un film sec, un produit durci, ainsi qu'une carte à circuit imprimé. La composition durcissable contient (A) un composant durcissable et (B) une charge traitée en surface, la composition durcissable, etc., étant caractérisée en ce qu'elle contient (B-1) une charge traitée en surface comprenant des groupes réactifs photodurcissables et des groupes réactifs thermodurcissables en tant que charge traitée en surface (B).
(JA) 強度に優れた硬化物を得ることができる硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物およびプリント配線板を提供する。(A)硬化性成分、および(B)表面処理フィラーを含有する硬化性組成物であって、前記(B)表面処理フィラーとして、(B-1)光硬化性反応基と熱硬化性反応基を有する表面処理フィラーを含有することを特徴とする硬化性組成物等である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)