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1. (WO2018123668) ELECTRONIC DEVICE
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Pub. No.: WO/2018/123668 International Application No.: PCT/JP2017/045206
Publication Date: 05.07.2018 International Filing Date: 15.12.2017
IPC:
H01P 3/00 (2006.01) ,H01Q 1/24 (2006.01) ,H04M 1/02 (2006.01)
[IPC code unknown for H01P 3][IPC code unknown for H01Q 1/24][IPC code unknown for H04M 1/02]
Applicants:
京セラ株式会社 KYOCERA CORPORATION [JP/JP]; 京都府京都市伏見区竹田鳥羽殿町6番地 6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi Kyoto 6128501, JP
Inventors:
平松 信樹 HIRAMATSU Nobuki; JP
西坂 直樹 NISHIZAKA Naoki; JP
西園 光博 NISHIZONO Mitsuhiro; JP
サガラ ジュニアディ アリフィン SAGALA Djuniadi Arifin; JP
Agent:
杉村 憲司 SUGIMURA Kenji; JP
Priority Data:
2016-25202626.12.2016JP
Title (EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(JA) 電子機器
Abstract:
(EN) Provided is an electronic device having a new structure contributing towards a reduction in size. This invention is provided with a first substrate 12A, a second substrate 12B, and a resin casing 11. Wiring, including a signal line for electrically connecting the first substrate 12A and the second substrate 12B, is formed on the resin casing 11. The wiring formed on the resin casing may include a ground. The invention may further be provided with a connection member for connecting the first substrate 12A and/or the second substrate 12B with the signal line, and a grounding member for connecting the first substrate 12A and/or the second substrate 12B with the ground.
(FR) L'invention concerne un dispositif électronique ayant une nouvelle structure contribuant à une réduction de taille. La présente invention comprend un premier substrat 12A, un second substrat 12B et un boîtier en résine 11. Un câblage, comprenant une ligne de signal pour connecter électriquement le premier substrat 12A et le second substrat 12B, est formé sur le boîtier en résine 11. Le câblage formé sur le boîtier en résine peut comprendre une masse. L'invention peut en outre comprendre un élément de connexion pour connecter le premier substrat 12A et/ou le second substrat 12B avec la ligne de signal, et un élément de mise à la terre pour connecter le premier substrat 12A et/ou le second substrat 12B à la masse.
(JA) 小型化に寄与する新たな構造の電子機器を提供する。 第1基板12Aと、第2基板12Bと、樹脂筐体11と、を備え、樹脂筐体11には、第1基板12Aと第2基板12Bとを電気的に接続するための信号線を含む配線が形成されている。樹脂筐体に形成されている配線はグランドを含んでよい。さらに、第1基板12Aおよび第2基板12Bの少なくとも一方と信号線とを接続する接続部材と、第1基板12Aおよび第2基板12Bの少なくとも一方とグランドとを接続する接地部材と、を備えてよい。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)