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1. (WO2018123643) CAMERA MODULE, METHOD FOR PRODUCING CAMERA MODULE,AND ELECTRONIC APPARATUS
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Pub. No.: WO/2018/123643 International Application No.: PCT/JP2017/045041
Publication Date: 05.07.2018 International Filing Date: 15.12.2017
IPC:
H01L 27/146 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
Applicants:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION [JP/JP]; 4-14-1, Asahi-cho, Atsugi-shi, Kanagawa 2430014, JP
Inventors:
KIMURA Katsuji; JP
SEKI Hirokazu; JP
Agent:
NISHIKAWA Takashi; JP
INAMOTO Yoshio; JP
Priority Data:
2016-25682928.12.2016JP
Title (EN) CAMERA MODULE, METHOD FOR PRODUCING CAMERA MODULE,AND ELECTRONIC APPARATUS
(FR) MODULE DE CAMÉRA, PROCÉDÉ DE FABRICATION DE MODULE DE CAMÉRA, ET APPAREIL ÉLECTRONIQUE
Abstract:
(EN) A camera module includes an imaging device. The imaging device has a solid-state image sensor and a glass substrate bonded to a light-incident side of the solid-state image sensor. The solid-state image sensor and the glass substrate together form an integral body. A circuit substrate is electrically coupled to the solid-state image sensor. A spacer fixes a position of the imaging device relative to the circuit substrate. The spacer has a fixing structure. The fixing structure has a plurality of first surfaces positioned closer to the imaging device than at least one second surface of the spacer. The at least one second surface of the spacer is separated from the imaging device by adhesive.
(FR) L'invention concerne un module de caméra comprenant un dispositif d'imagerie. Le dispositif d'imagerie comprend un capteur d'image à semi-conducteurs et un substrat en verre lié à un côté d'incidence de lumière du capteur d'image à semi-conducteurs. Le capteur d'image à semi-conducteurs et le substrat en verre forment ensemble un corps intégral. Un substrat de circuit est couplé électriquement au capteur d'image à semi-conducteurs. Un élément d'espacement fixe une position du dispositif d'imagerie par rapport au substrat de circuit. L'élément d'espacement a une structure de fixation. La structure de fixation a une pluralité de premières surfaces positionnées plus près du dispositif d'imagerie qu'au moins une seconde surface de l'élément d'espacement. Ladite seconde surface de l'élément d'espacement est séparée du dispositif d'imagerie par un adhésif.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)