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1. (WO2018123579) METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL
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Pub. No.: WO/2018/123579 International Application No.: PCT/JP2017/044645
Publication Date: 05.07.2018 International Filing Date: 13.12.2017
IPC:
H01M 4/38 (2006.01) ,C23C 18/31 (2006.01) ,C23C 18/50 (2006.01) ,C22C 19/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
4
Electrodes
02
Electrodes composed of, or comprising, active material
36
Selection of substances as active materials, active masses, active liquids
38
of elements or alloys
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
48
Coating with alloys
50
with alloys based on iron, cobalt or nickel
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
19
Alloys based on nickel or cobalt
Applicants:
株式会社豊田自動織機 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI [JP/JP]; 愛知県刈谷市豊田町2丁目1番地 2-1, Toyoda-cho, Kariya-shi, Aichi 4488671, JP
Inventors:
齊田 潤 SAIDA, Jun; JP
Agent:
特許業務法人 共立 KYORITSU INTERNATIONAL; 愛知県名古屋市中村区名駅3丁目2番5号 2-5, Meieki 3-chome, Nakamura-ku, Nagoya-shi, Aichi 4500002, JP
Priority Data:
2016-25355027.12.2016JP
2016-25357927.12.2016JP
2017-12995730.06.2017JP
Title (EN) METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL
(FR) PROCÉDÉ DE PRODUCTION DE MATÉRIAU D'ÉLECTRODE NÉGATIVE
(JA) 負極材料の製造方法
Abstract:
(EN) The present invention provides a technique which is able to improve the electrical conductivity of a negative electrode material that comprises hydrogen storage alloy particles. A method for producing a negative electrode material, which comprises: a plating solution preparation step wherein a plating solution containing a nickel salt, a hetero element-containing organic compound and an aqueous solvent is obtained; and a plating step wherein a hydrogen storage alloy particle dispersion liquid, which contains an aqueous solvent and hydrogen storage alloy particles, the plating solution and a reducing agent are mixed with each other, thereby obtaining a negative electrode material wherein a plating layer containing nickel is formed on the hydrogen storage alloy particles.
(FR) La présente invention concerne une technique qui est capable d'améliorer la conductivité électrique d'un matériau d'électrode négative qui comprend des particules d'alliage de stockage d'hydrogène. L'invention concerne un procédé de production d'un matériau d'électrode négative, qui comprend : une étape de préparation de solution de placage dans laquelle une solution de placage contenant un sel de nickel, un composé organique contenant un hétéro-élément et un solvant aqueux est obtenue; et une étape de placage dans laquelle un liquide de dispersion de particules d'alliage de stockage d'hydrogène, qui contient un solvant aqueux et des particules d'alliage de stockage d'hydrogène, la solution de placage et un agent réducteur sont mélangés l'un à l'autre, ce qui permet d'obtenir un matériau d'électrode négative dans lequel une couche de placage contenant du nickel est formée sur les particules d'alliage de stockage d'hydrogène.
(JA) 水素吸蔵合金粒子を有する負極材料の導電性を向上させ得る技術を提供すること。 ニッケル塩、ヘテロ元素含有有機化合物及び水系溶媒を含有するメッキ溶液を得るメッキ溶液調製工程と、 水系溶媒及び水素吸蔵合金粒子を含有する水素吸蔵合金粒子分散液と、前記メッキ溶液と、還元剤と、を混合して、前記水素吸蔵合金粒子上にニッケルを含むメッキ層が形成された負極材料を得るメッキ工程と、を有する負極材料の製造方法。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)