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1. (WO2018123557) CIRCUIT CONSTRUCTION AND METHOD FOR MANUFACTURING SAME

Pub. No.:    WO/2018/123557    International Application No.:    PCT/JP2017/044511
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Wed Dec 13 00:59:59 CET 2017
IPC: H05K 1/02
H02G 3/16
H05K 3/00
H05K 3/34
Applicants: AUTONETWORKS TECHNOLOGIES, LTD.
株式会社オートネットワーク技術研究所
SUMITOMO WIRING SYSTEMS, LTD.
住友電装株式会社
SUMITOMO ELECTRIC INDUSTRIES, LTD.
住友電気工業株式会社
Inventors: SHIMIZU Tatsuya
清水 達哉
Title: CIRCUIT CONSTRUCTION AND METHOD FOR MANUFACTURING SAME
Abstract:
A circuit construction 1 is provided with a bus bar group 31 comprising a plurality of bus bars 31A, 31B, 31C that are laterally arranged, a circuit substrate 20 disposed over the bus bar group 31, and an electronic component 50 connected between the plurality of bus bars 31A, 31B and across the circuit substrate 20. The bus bar group 31 is provided with a plurality of projections 32A, 32B protruding to the same height as a connecting surface 20A of the circuit substrate 20 for connecting the electronic component 50. The electronic component 50 is connected to the plurality of projections 32A, 32B and the circuit substrate 20. The plurality of bus bars 31A, 31B, 31C mutually and the circuit substrate 20 are mutually in a state of being solidified with resin 40, 40A, 40B.