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1. (WO2018123414) INTERPOSER SUBSTRATE, CIRCUIT MODULE, METHOD FOR MANUFACTURING INTERPOSER CIRCUIT

Pub. No.:    WO/2018/123414    International Application No.:    PCT/JP2017/042938
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Dec 01 00:59:59 CET 2017
IPC: H05K 1/02
H01R 12/62
H05K 1/14
H05K 3/36
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: YAZAKI Hirokazu
矢▲崎▼ 浩和
YONEMORI Keito
米森 啓人
TSUCHIYA Takanori
土屋 貴紀
KAMADA Koji
鎌田 晃史
NOMA Takashi
野間 隆嗣
Title: INTERPOSER SUBSTRATE, CIRCUIT MODULE, METHOD FOR MANUFACTURING INTERPOSER CIRCUIT
Abstract:
An interposer substrate (10), provided with an elementary body (20), external connection conductors (31, 32, 33), and wiring conductors (340, 350). The elementary body (20) has a first main surface (201), a second main surface (202), and a third main surface (203). The distance (D12) between the first main surface (201) and the second main surface (202) is different from the distance (D22) between the first main surface (201) and the third main surface (203). The external connection conductors (31) are formed on the first main surface (201) and connected to an external circuit board. The external connection conductors (32) are formed on the second main surface (202) and connected to a first flat cable. The external connection conductors (33) are formed on the third main surface (203) and connected to a second flat cable. The wiring conductors (340, 350) are formed on the elementary body (20) and connect the external connection conductors (31) with the external connection conductors (32, 33).