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1. (WO2018123382) CIRCUIT MODULE

Pub. No.:    WO/2018/123382    International Application No.:    PCT/JP2017/042218
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Sat Nov 25 00:59:59 CET 2017
IPC: H01L 23/29
H01L 23/31
H01L 25/00
H03H 9/25
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: OKADA, Ken
岡田 健
SATO, Kazushige
佐藤 和茂
FUNAKAWA, Shingo
舟川 慎吾
FUJIKAWA, Katsuhiko
藤川 勝彦
AMACHI, Nobumitsu
天知 伸充
Title: CIRCUIT MODULE
Abstract:
A circuit module (101) is provided with: a substrate (1) having a main surface (1a); a first component (6) mounted on the main surface (1a); and a sealing resin section (3) that covers at least the side surface of the first component (6), while covering the main surface (1a). The first component (6) has a hollow section (6c), and the first component (6) is provided with a connecting section (6b) exposed to the hollow section (6c). The sealing resin section (3) is disposed on an area excluding at least a part of an upper surface region of the first component (6), said upper surface region corresponding to the hollow section (6c).