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1. (WO2018123189) RADIATION IMAGING DEVICE, METHOD FOR MANUFACTURING RADIATION IMAGING DEVICE, AND IMAGING SYSTEM

Pub. No.:    WO/2018/123189    International Application No.:    PCT/JP2017/036226
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Oct 06 01:59:59 CEST 2017
IPC: H01L 27/144
A61B 6/00
G01T 1/20
G01T 7/00
H01L 27/146
Applicants: CANON KABUSHIKI KAISHA
キヤノン株式会社
Inventors: KOMATSU, Tomoki
小松 知貴
SARUTA, Shoshiro
猿田 尚志郎
ISHII, Takamasa
石井 孝昌
ICHIMURA, Tomoaki
市村 知昭
OIKE, Tomoyuki
大池 智之
Title: RADIATION IMAGING DEVICE, METHOD FOR MANUFACTURING RADIATION IMAGING DEVICE, AND IMAGING SYSTEM
Abstract:
In a radiation imaging device provided with two sensor panels, the present invention provides an advantageous feature for suitably realizing connection of wiring parts thereof. The radiation imaging device of the present invention is provided with a first panel for which a first radiation imaging unit is arranged on a first substrate, and a second panel for which a second radiation imaging unit is arranged on a second substrate. The first panel and the second panel are arranged so that, in a plan view with respect to the top surface of the first substrate, there is an area of mutual overlap, and an area of no mutual overlap, and also so that at least a portion of the first radiation imaging unit and at least a portion of the second radiation imaging unit are positioned in the overlapping area in the plan view. The first panel has a first connection part to which there is connected a first wiring part for reading signals from the first radiation imaging unit in the area where there is no overlap with the second panel in the plan view, and the second panel has a second connection part to which there is connected a second wiring part for reading signals from the second radiation imaging unit in the area where there is no overlap with the first panel in the plan view.