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1. (WO2018123183) SILICON TARGET MATERIAL
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Pub. No.: WO/2018/123183 International Application No.: PCT/JP2017/035924
Publication Date: 05.07.2018 International Filing Date: 03.10.2017
IPC:
C23C 14/34 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
Applicants:
三菱マテリアル電子化成株式会社 MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD. [JP/JP]; 秋田県秋田市茨島三丁目1番6号 1-6, Barajima 3-chome, Akita-shi, Akita 0108585, JP
大同特殊鋼株式会社 DAIDO STEEL CO., LTD. [JP/JP]; 愛知県名古屋市東区東桜一丁目1番10号 1-10, Higashisakura 1-chome, Higashi-ku, Nagoya-shi, Aichi 4618581, JP
Inventors:
金井 昌弘 KANAI, Masahiro; JP
続橋 浩司 TSUZUKIHASHI, Koji; JP
小西 希 KONISHI, Nozomi; JP
萩原 正弘 HAGIWARA, Masahiro; JP
勝見 昌高 KATSUMI, Masataka; JP
小林 和人 KOBAYASHI, Kazuhito; JP
Agent:
須田 正義 SUDA, Masayoshi; JP
Priority Data:
2016-25055526.12.2016JP
Title (EN) SILICON TARGET MATERIAL
(FR) MATÉRIAU CIBLE DE SILICIUM
(JA) シリコンターゲット材
Abstract:
(EN) In the present invention, on the surface of a rectangular plate-shaped target material (10), a groove section (13) that extends in the longitudinal direction is formed in the width-direction center of the target material (10) as a virtual region that is designed not to be spattered. If the width (W1) of the surface of the target material (10) is 100%, the width (W2) of the groove section (13) is 20–40%. Moreover, curved surfaces are formed in corner sections (14) of the groove section (13), and it is preferable that the radius of curvature at the mouth edge of the corner sections (14) be at least 1.0 mm.
(FR) Dans la présente invention, sur la surface d'un matériau cible en forme de plaque rectangulaire (10), une section rainure (13) qui s'étend dans le sens longitudinal est formée au centre du matériau cible (10) dans le sens de la largeur à titre de région virtuelle qui n'est pas destinée à être soumise à pulvérisation. Si la largeur (W1) de la surface du matériau cible (10) est de 100 %, la largeur (W2) de la section rainure (13) est de 20 à 40 %. De plus, des surfaces incurvées sont formées dans les sections cornières (14) de la section rainure (13), et de préférence, le rayon de courbure en bord d'ouverture desdites sections cornières (14) est d'au moins 1,0 mm.
(JA) 長方形板状のターゲット材(10)の表面には、設計上スパッタリングされない仮想領域として、ターゲット材(10)の幅方向の中央に長手方向に延びる溝部(13)が形成される。溝部(13)の幅(W2)は、ターゲット材(10)表面の幅(W1)を100%とするとき20~40%である。また、溝部(13)のコーナ部(14)は湾曲面に形成され、このコーナ部(14)の口元の曲率半径は1.0mm以上であることが好ましい。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)