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1. (WO2018123170) SENSOR MODULE, TEMPLE, FRAME AND EYEWEAR
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Pub. No.: WO/2018/123170 International Application No.: PCT/JP2017/034404
Publication Date: 05.07.2018 International Filing Date: 25.09.2017
IPC:
G06F 3/02 (2006.01) ,G02C 5/14 (2006.01) ,G02C 7/02 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
02
Input arrangements using manually operated switches, e.g. using keyboards or dials
G PHYSICS
02
OPTICS
C
SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
5
Constructions of non-optical parts
14
Side-members
G PHYSICS
02
OPTICS
C
SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
7
Optical parts
02
Lenses; Lens systems
Applicants:
三井化学株式会社 MITSUI CHEMICALS, INC. [JP/JP]; 東京都港区東新橋一丁目5番2号 5-2, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo 1057122, JP
Inventors:
菅 竜貴 KAN, Ryuki; --
大戸 孝文 OHTO, Takafumi; --
増田 修 MASUDA, Osamu; --
Agent:
鷲田 公一 WASHIDA, Kimihito; JP
Priority Data:
2016-25327227.12.2016JP
Title (EN) SENSOR MODULE, TEMPLE, FRAME AND EYEWEAR
(FR) MODULE DE CAPTEUR, TEMPE, CADRE ET LUNETTES
(JA) センサーモジュール、テンプル、フレームおよびアイウェア
Abstract:
(EN) Provided is a sensor module that includes: a casing; a contacted part that is disposed so that at least a part thereof is exposed to the outside of the casing and that has conductivity; and a detection part that has an electrostatic capacitance type detection pad and that is disposed inside the casing. The detection part further includes a conductive plate provided so as to correspond to the detection region of the detection pad, the contacted part being electrically connected to the conductive plate. This configuration makes it possible to provide a sensor module that is highly sensitive to contact with an object, and that prevents damage to the detection pad caused by contact with the object.
(FR) L'invention concerne un module de capteur qui comprend : un boîtier ; une partie en contact qui est disposée de telle sorte qu'au moins une partie de celui-ci est exposée à l'extérieur du boîtier et qui a une conductivité ; et une partie de détection qui a un plot de détection de type à capacité électrostatique et qui est disposée à l'intérieur du boîtier. La partie de détection comprend en outre une plaque conductrice disposée de manière à correspondre à la région de détection du plot de détection, la partie en contact étant électriquement connectée à la plaque conductrice. Cette configuration permet de produire un module de capteur qui est très sensible au contact avec un objet, et qui empêche que le plot de détection subisse des dommages provoqués par le contact avec l'objet.
(JA) センサモジュールを、筐体と、少なくとも一部が筐体の外部に露出するように配置されており、かつ導電性を有する被接触部と、静電容量方式の検出パッドを有し筐体の内部に配置されている検出部と、を有し、検出部が、検出パッドの検出領域に対応して設けられた導電板を更に含み、被接触部が導電板と電気的に接続されるように構成する。これにより対象物の接触による検出パッドの損傷を防ぎつつも、対象物の接触に対する感度が高いセンサモジュールを提供する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)