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1. (WO2018123132) METHOD FOR REPAIRING BACKING PLATE FOR SPUTTERING TARGET, REPAIRED BACKING PLATE, AND SUPPTERING TARGET USING REPAIRED BACKING PLATE
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Pub. No.: WO/2018/123132 International Application No.: PCT/JP2017/029978
Publication Date: 05.07.2018 International Filing Date: 22.08.2017
IPC:
C23C 14/34 (2006.01) ,B05B 7/16 (2006.01) ,C23C 24/04 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
B PERFORMING OPERATIONS; TRANSPORTING
05
SPRAYING OR ATOMISING IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
B
SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
7
Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
16
incorporating means for heating the material to be sprayed
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
24
Coating starting from inorganic powder
02
by application of pressure only
04
Impact or kinetic deposition of particles
Applicants:
株式会社コベルコ科研 KOBELCO RESEARCH INSTITUTE, INC. [JP/JP]; 兵庫県神戸市中央区脇浜海岸通1丁目5番1号 1-5-1, Wakinohama-kaigan-dori, Chuo-ku, Kobe-shi, Hyogo 6510073, JP
Inventors:
大内 康裕 OUCHI, Yasuhiro; --
畠 英雄 HATA, Hideo; --
中根 靖夫 NAKANE, Yasuo; --
Agent:
鮫島 睦 SAMEJIMA, Mutsumi; JP
山尾 憲人 YAMAO, Norihito; JP
Priority Data:
2016-25635628.12.2016JP
Title (EN) METHOD FOR REPAIRING BACKING PLATE FOR SPUTTERING TARGET, REPAIRED BACKING PLATE, AND SUPPTERING TARGET USING REPAIRED BACKING PLATE
(FR) PROCÉDÉ DE RÉPARATION D'UNE PLAQUE DE SUPPORT POUR CIBLE DE PULVÉRISATION, PLAQUE DE SUPPORT RÉPARÉE ET CIBLE DE PULVÉRISATION UTILISANT UNE PLAQUE DE SUPPORT RÉPARÉE
(JA) スパッタリングターゲット用バッキングプレートの補修方法、補修済みバッキングプレートおよび補修済みバッキングプレートを用いたスパッタリングターゲット
Abstract:
(EN) An embodiment of the present invention is a method for repairing a backing plate 20 comprising a copper base 22 with a deficient area 24. The method comprises a step for polishing the surface of the deficient area 24, and a step after the polishing step for spraying and depositing repair particles on the deficient area 24. The repair particles comprise copper particles and ceramic particles.
(FR) Un mode de réalisation de la présente invention concerne un procédé de réparation d'une plaque de support (20) comprenant une base en cuivre (22) ayant une zone déficiente (24). Le procédé comprend une étape de polissage de la surface de la zone déficiente (24), et une étape, ultérieure à l'étape de polissage, consistant à pulvériser et à déposer des particules de réparation sur la zone déficiente (24). Les particules de réparation comportent des particules de cuivre et des particules de céramique.
(JA) 本発明の実施形態は、欠損部24を有する銅製のベース22を含むバッキングプレート20を補修する方法であって、前記欠損部24の表面を研磨する工程と、前記研磨する工程後に、補修用粒子を前記欠損部24に吹き付けて堆積させる工程と、を含み、前記補修用粒子が、銅粒子とセラミック粒子とを含む。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)