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1. (WO2018123064) SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/123064    International Application No.:    PCT/JP2016/089209
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Fri Dec 30 00:59:59 CET 2016
IPC: H01L 23/02
H01L 23/12
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: ITO, Masayasu
伊藤 正康
MIYAWAKI, Katsumi
宮脇 勝巳
ICHINOHE, Hiroaki
一戸 洋暁
TSURUMAKI, Takashi
鶴巻 隆
Title: SEMICONDUCTOR DEVICE
Abstract:
The present invention is characterized by including: a heat sink; an integrated component which is fixed to the heat sink and integrates a matching circuit and a ceramic terminal having a microstrip line; a lead fixed to the ceramic terminal; an integrated substrate fixed to the heat sink; a semiconductor chip fixed to the heat sink; a plurality of wires connecting the matching circuit and the integrated substrate and electrically connecting the integrated substrate and the semiconductor chip; a frame surrounding the integrated substrate and the semiconductor chip in plan view; and a cap provided on the frame.