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|1. (WO2018123064) SEMICONDUCTOR DEVICE|
|Applicants:||MITSUBISHI ELECTRIC CORPORATION
The present invention is characterized by including: a heat sink; an integrated component which is fixed to the heat sink and integrates a matching circuit and a ceramic terminal having a microstrip line; a lead fixed to the ceramic terminal; an integrated substrate fixed to the heat sink; a semiconductor chip fixed to the heat sink; a plurality of wires connecting the matching circuit and the integrated substrate and electrically connecting the integrated substrate and the semiconductor chip; a frame surrounding the integrated substrate and the semiconductor chip in plan view; and a cap provided on the frame.