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1. (WO2018122995) THIN-FILM CAPACITOR AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2018/122995    International Application No.:    PCT/JP2016/089021
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Dec 29 00:59:59 CET 2016
IPC: H01L 21/822
H01L 27/04
Applicants: NODA SCREEN CO., LTD.
株式会社野田スクリーン
Inventors: YOSHIZAWA Masamitsu
吉澤 正充
HATTORI Atsunori
服部 篤典
HATANO Hirotaka
波多野 弘孝
KUSUMOTO Kazuki
楠本 和貴
Title: THIN-FILM CAPACITOR AND SEMICONDUCTOR DEVICE
Abstract:
A thin-film capacitor (20) disposed on a rewiring layer (10) of a semiconductor device (100) including a semiconductor chip (50), wherein the thin-film capacitor (20) comprises: a capacitor unit (21) made up of a first electrode (21A), a dielectric body (21B) formed on the first electrode, and a second electrode (21C) formed on the dielectric body; and an adhesion section (22) which is provided to the bottom surface of the first electrode (21A) and is used when adhering the thin-film capacitor (20) to a protective film (52) of the semiconductor chip (50). The total thickness of the capacitor unit (21) and the adhesion section (22) is 20 μm or less.