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1. (WO2018122992) RESIST REMOVAL SOLUTION

Pub. No.:    WO/2018/122992    International Application No.:    PCT/JP2016/089014
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Thu Dec 29 00:59:59 CET 2016
IPC: G03F 7/42
Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
パナソニックIPマネジメント株式会社
Inventors: KITO Yusuke
鬼頭 佑典
FUCHIGAMI Shinichirou
淵上 真一郎
Title: RESIST REMOVAL SOLUTION
Abstract:
In processes for manufacturing semiconductor devices, etc., curing is performed at a temperature higher than in conventional practice to avoid defective curing of resists. A removal solution having a removing power greater than in conventional practice is therefore required. A resist removal solution containing a primary and/or secondary amine as an amine, containing a diethylene glycol monoethyl ether (EDG), a propylene glycol (PG), and water as a polar solvent, and containing hydrazine as an additive, the amine being more than 3.0 mass% and no more than 20.0 mass%, the diethylene glycol monoethyl ether being more than 39.5 mass% and no more than 59.5 mass%, the water being more than 5.18 mass% and less than 28.18 mass%, and the hydrazine being more than 0.064 mass% and no more than 1.28 mass%, wherein the resist removal solution can remove a resist film that was baked at high temperatures, does not cause corrosion at a metal film surface and cross section, and exhibits superior regeneration efficiency when reused.