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1. (WO2018122971) ELECTROCONDUCTIVE PASTE, ELECTRONIC SUBSTRATE, AND METHOD FOR MANUFACTURING SAID SUBSTRATE

Pub. No.:    WO/2018/122971    International Application No.:    PCT/JP2016/088929
Publication Date: Fri Jul 06 01:59:59 CEST 2018 International Filing Date: Wed Dec 28 00:59:59 CET 2016
IPC: H01B 1/22
H01B 1/00
H05K 1/09
H05K 3/12
Applicants: MITSUBOSHI BELTING LTD.
三ツ星ベルト株式会社
Inventors: KOBAYASHI Hiroji
小林 広治
HAYASHI Yoko
林 耀広
Title: ELECTROCONDUCTIVE PASTE, ELECTRONIC SUBSTRATE, AND METHOD FOR MANUFACTURING SAID SUBSTRATE
Abstract:
The present invention pertains to an electroconductive paste containing: high melting point metal particles having a melting point that exceeds the firing temperature; molten metal particles containing a metal or an alloy that melts at the firing temperature, for which the melting point is 700°C or less; active metal particles containing an active metal; and an organic vehicle.