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1. (WO2018122503) PULSED LASER METHOD FOR MACHINING A DIAMOND, MAKING IT POSSIBLE TO OBTAIN A SMOOTH AND TRANSPARENT SURFACE
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2018/122503 International Application No.: PCT/FR2017/053766
Publication Date: 05.07.2018 International Filing Date: 21.12.2017
IPC:
B23K 26/08 (2014.01) ,B28D 5/00 (2006.01) ,B23K 26/122 (2014.01) ,B23K 26/362 (2014.01) ,B23K 26/38 (2014.01) ,B23K 26/402 (2014.01) ,C01B 32/25 (2017.01) ,B23K 103/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
08
Devices involving relative movement between laser beam and workpiece
B PERFORMING OPERATIONS; TRANSPORTING
28
WORKING CEMENT, CLAY, OR STONE
D
WORKING STONE OR STONE-LIKE MATERIALS
5
Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
[IPC code unknown for B23K 26/122][IPC code unknown for B23K 26/362]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
[IPC code unknown for B23K 26/402][IPC code unknown for C01B 32/25]
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
Applicants:
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES [FR/FR]; Bâtiment "Le Ponant D", 25 rue Leblanc 75015 PARIS, FR
Inventors:
RUAUDEL, Eglantine; FR
WECK, Gunnar; FR
PLISSON, Thomas; FR
Agent:
SANTARELLI; 49 avenue des Champs-Elysées 75008 PARIS, FR
Priority Data:
166347928.12.2016FR
Title (EN) PULSED LASER METHOD FOR MACHINING A DIAMOND, MAKING IT POSSIBLE TO OBTAIN A SMOOTH AND TRANSPARENT SURFACE
(FR) PROCEDE D'USINAGE PAR LASER IMPULSIONNEL D'UN DIAMANT PERMETTANT D'OBTENIR UNE SURFACE LISSE ET TRANSPARENTE
Abstract:
(EN) To machine a diamond (2) using a pulsed laser, the diamond (2) is placed in a container (20) containing a transparent liquid (3). The liquid level is at least 100 microns above a surface of the diamond (2) to be machined, and said transparent liquid (3) can further contain a surfactant additive in an amount of at least 2% and 10% by mass. Next, a laser source (10) is activated such that a laser beam (1) with pulse durations of no longer than one microsecond at a repetition frequency of no more than 5 kHz is applied to the surface to be machined, and relative scanning is performed between the diamond (2) and the laser source (10), cross-wise to the laser beam (1) and axially in depth, with an amplitude and orientations that are determined by the shape to be machined in the diamond (2).
(FR) Pour usiner un diamant (2) au moyen d'un laser impulsionnel, on place le diamant (2) dans un récipient (20) contenant un liquide (3) transparent dont le niveau est situé au moins à 100 microns au- dessus d'une surface du diamant (2) qui est à usiner, ce liquide (3) transparent pouvant contenir un additif tensio-actif à une teneur au moins égale à 2% et 10% en masse. Puis on active une source laser (10) en sorte d'appliquer à la surface à usiner un faisceau laser (1) ayant des impulsions de durée au plus égale à une microseconde à une fréquence de répétition d'au plus 5 kHz, et on commande un balayage relatif entre le diamant (2) et la source laser (10), transversalement au faisceau laser (1) et axialement en profondeur, avec une amplitude et des orientations déterminées par la forme de l'usinage à réaliser dans le diamant (2).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: French (FR)
Filing Language: French (FR)